Royma helps electronics and consumer electronics manufacturers secure internal quality in ever more compact and integrated designs. Our CT systems reveal hidden defects in solder joints, vias, connectors, batteries, camera modules and encapsulated assemblies that conventional 2D X‑ray often misses. Engineers detect head‑in‑pillow, voiding, bridging, cracked components, misalignments and assembly deviations in a single 3D scan, supporting rapid failure analysis and robust process windows from SMT to final device assembly. Building on early engagement with inline CT projects for Foxconn production inspection, Royma brings this experience to a wider customer base, enabling high‑throughput, traceable inspection that protects yield, reliability and brand reputation.